Job Description

Triple Crown is a leading provider of hardware, embedded, software, and mechanical engineering talent. Businesses and technology teams, from Fortune 500 enterprises to emerging startups, rely on our ability to rapidly place the developers, architects, coders, and designers who engineer digital transformation and growth.

CONTRACT Position: 6+ Months

Location: Onsite in Saratoga, CA (remote is okay if candidate is based in West Coast time zone)

US Citizens

We are seeking an experienced Senior IC Packaging Engineer for a contract position to lead the design, development, and validation of advanced semiconductor packaging solutions. You will collaborate with cross-functional teams to deliver high-performance, cost-effective, and reliable packaging for cutting-edge IC products.

• BS/MS in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• 5–10+ years of experience in IC packaging design and development.
• Strong knowledge of industry-standard packaging technologies and trends.
• Experience with simulation tools (e.g., ANSYS, Abaqus, Icepak, HFSS, SI/PI tools).
• Familiarity with CAD/EDA tools (e.g., AutoCAD, Cadence APD/SIP, Mentor).
• Experience working with OSATs and semiconductor foundries.
• Excellent problem-solving skills and ability to lead cross-disciplinary efforts.
• IC package design with Siemens APD for CPU and AI substrates
• High-performance chip packaging for advanced compute applications
• End-to-end layout planning across silicon and packaging layers
• Experience with 3D-IC and chiplet architectures

Skills:

• IC Packaging
• 3D-IC
• Siemens APD
• CPU

Benefits:

• Paid weekly!
• Health, Dental and Vision Insurance
• 401k

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